PFC Flexible Circuits Expands Service Offerings with ESI Model 5335 Laser Processing System
source:ESI
release:Johnny
keywords:laserESIElectroScientificIndustries
Time:2015-07-16
"PFC has been supplying fine line technology for the past eight years. Now, with the addition of the Model 5335, we can support true HDI flex technologies," said
PFC chose the ESI Model 5335 in part because of its high throughput capabilities compared to alternatives. For example, the ESI Model 5335 can drill 50 micron blind vias at a rate of 32,000 holes per minute. This performance is made possible by Third Dynamics™, a patented high-speed beam positioning technology that enables fast and accurate routing and drilling of flexible circuits.
"We were looking to updat our drilling technology without losing throughput," said
The ESI Model 53XX family is widely regarded as the industry standard for laser processing across the flexible circuit and interconnect industry. Over 1,200 ESI laser processing systems are installed worldwide and are in use at nine of the top 10 flex circuit manufacturers. These systems offer industry-leading drill, routing, patterning, and skiving performance.
"We are extremely pleased that PFC has decided to incorporate ESI laser processing technology into its HDI and flexible circuit manufacturing processes," said
about PFC
PFC Flexible Circuits designs, manufactures and assembles flexible printed circuits, all under one roof. Circuit types include single- and double-sided, multi-layer and rigid flex. PFC can provide 50 micron line and space in production and assemble circuits using 1005 components. Specialties include high-speed low-loss, impedance-controlled circuits. PFC offers a large library of UL approved materials and is ISO 9001 and 13485 approved. For more information go to:http://www.pfcflex.com.
about ESI
ESI's integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials in ways that differentiate their consumer electronics, wearable devices, semiconductor circuits and high-precision components for market advantage. ESI's laser-based manufacturing solutions feature the micro-machining industry's highest precision and speed, and target the lowest total cost of ownership. ESI is headquartered in
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