Photonic Integrated Circuits Conference: High speed photonic integrated receivers for 100G and above

source:laserfair.com

release:Johnny Lee

keywords:PICphotonics

Time:2015-09-02

High speed photonic integrated receivers for 100G and above - William Ring

Abstract:

Integration of Photonics on chip is necessary to address the future demands of the datacenter.

The market demands for low cost, small footprint and low power require innovation in the design of the photonic components. To reduce power and to enable on-chip integration requires designs that enable minimal temperature variation of MUX/De-MUX for the wavelength control and management.

BB Photonics is developing a platform approach integrating low loss dielectrics into InP wafers for wavelength routing and functionality to enable mode matched devices that have a low thermal variation.

This unique approach reduces size, cost, adds functionality and enables high coupling to the passive waveguides from the III-V components that can then be integrated with Spot-size converters and high-speed waveguide devices.

The current work on 100GbE LR4 device integration will be discussed.


2 days, 6 themes, 30+ presentations

Sales of PICs are soaring, with their deployment helping to boost the capacity of networks and data centres. To aid this industry, we are strengthening the relationships between the makers and the users of these integrated circuits by launching PIC International, a global conference dedicated to this industry.

Attendees at the inaugural PIC International conference will hear industry-leading insiders delivering more than 30 presentations spanning six sectors.

PIC International provides comprehensive coverage of all aspects of this industry, from basic research to materials, equipment, packaging, and the incorporation of chips in data centres and optical networks. So whether you focus on system integration, developing and manufacturing components, financing this sector, or providing the materials and equipment needed to support this industry, PIC International is your must-attend conference for 2016.

PIC International will be co-located with the sixthCS International conference(Compound Semiconductor).

Presentations commited to date include:

Aarhus University
ArtIC Photonics
Aurrion
BB Photonics
CEA-Leti
CISCO
Coriant
Finisar
Evans Analytical Group
EV Group

Global Communication Semiconductors
HP
Huawei
IBM
Istituto Superiore Mario Boella
JePPIX
LioniX BV
Luceda Photonics

McGill University
Mellanox Technologies
Microsoft
NTT Photonics Labs
PhoeniX Software
Politecnico di Milano
Ranovus
Smart Photonics
TeraXion
TU Eindhoven

Baidu
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