Topics of Photonic Integrated Circuits conference光电集成电路大会News_

Topics of Photonic Integrated Circuits conference光电集成电路大会

source：laserfair.com

release：Johnny Lee

keywords：Photonic Integrated Circuits conference

Time：2015-10-09

1. How can silicon photonics benefit optical access deployment? An example from the FABULOUS EU Project

Silvio Abrate - ISMB

Employing Silicon-Photonics doesn’t just mean replacing conventional components with SiP components, but also means conceiving devices with a focused approach. The FABULOUS European Project proposes a WDM FDM PON based on an innovative ONU that would be very expensive and complicated if realized with discrete components, but simple if realized as a SiP-based PIC.. In this talk, the architecture of the network with a maximum performances benchmarking, made with discrete components, will be explained, and a prototype version of the SiP ONU will be shown, demonstrating how SiP can be a fundamental technology for enabling low-cost FTTH with high performances.

2. Photonic circuits enabling multi-dimensional IM/DD systems for short reach optical interconnects

Dave Plant - McGill University

3. Silicon photonics in optical networking – yesterday's hype, today's reality, tomorrow's vision.

Harald Bock - Coriant

With on-going demand for network capacity, an increasing level of integration of optical and electro nic compo nents is critical to reducing the associated costs of power co nsumption and footprint of optical WAN networking equipment. Silicon photo nics is quickly becoming one of the key technologies driving innovation in this field. This talk will explore the expectations silicon photo nics has raised and will perform a reality check on its value in optical networks today. It will also look to the future and the benefit this technology can bring to the data transmission backbone of future cloud networks.

Sales of PICs are soaring, with their deployment helping to boost the capacity of networks and data centres. To aid this industry, we are strengthening the relatio nships between the makers and the users of these integrated circuits by launching PIC International, a global co nference dedicated to this industry.

Attendees at the inaugural PIC Internatio nal co nference will hear industry-leading insiders delivering more than 30 presentations spanning six sectors.

PIC Internatio nal provides comprehensive coverage of all aspects of this industry, from basic research to materials, equipment, packaging, and the incorporation of chips in data centres and optical networks. So whether you focus on system integration, developing and manufacturing components, financing this sector, or providing the materials and equipment needed to support this industry, PIC Internatio nal is your must-attend co nference for 2016.

PIC Internatio nal will be co-located with the sixth CS International conference(Compound Semiconductor).

Tel: +44 (0)2476 718970
Website: www.picinternational.net
Email: info@picinternational.net
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