PicoMaster具有短皮秒脉冲的特性，几乎可以加工任何材料，是一种经济高效的选择，PicoMaster的工业化设计使其能够在相对较高的速度下对几乎任何材料进行微米量级的加工。

特性

• 10 ps超快皮秒激光光源
• 小至5 µm的激光光斑
• 最高达100 kHz的重复频率
• 高精度三维 XYZ 工件定位
• 单脉冲激光能量可达200 µJ
• 重复性高
• 可进行亚波长级的加工
• 材料去除率高
• 可根据要求提供多种波长的激光光源
• 符合Class 1 激光安全标准
• 运行维护成本低
• 通用火线 (IEEE-1394)计算机控制接口
• 控制方便

相关应用

• 打孔:
  – 各种材料上几微米至几百微米直径圆形孔的加工
  – 高深径比注射器打孔
  – 气化喷雾和注射喷嘴打孔
• 剥蚀
• 打标（表面和透明材料内部）
• 切割
• 表面结构纹理的加工和制备

该系统的核心是能够达到100KHz的高重复频率的半导体泵浦固体激光器件，先进的光学设计和制作能够保证激光光点小于5微米。高度自动化的控制系统，操作简单易用。而用户友好的开放性软件保证了系统加工能力的灵活性-可根据应用自由改造。该系统使用的是对人体安全的I级激光，而良好的封闭外围， 隔离振动的加工平台保证足以确保超精细加工的可信性。
对于希望获得节省时间和成本，同时要求高精度理想脉宽的激光，快速高精度定位和激光聚焦的科研人员或工程师而言，PicoMaster是个绝佳的选择。

丰富的用户定制可选功能

• 视频监测系统用于加工过程控制
• 双轴电流计式振镜用于复杂的高速激光束扫描，切割式钻孔，以及激光刻划
• 用于螺旋钻孔和光束偏振控制的特殊光路系统
• 旋转和倾斜轴增加了加工的自由度
• 用户定制软件功能
• 1064 nm, 532 nm, 355 nm (和/或)工作波长
• 配用其它类型激光器

Picomaster series ultrafast micromachining workstation design

A Class 1 laser-safe enclosure conceals:

Positioning system
Positioning axes are supported by a rigid vibrationisolated granite platform. Mechanical robustness ensures high positioning accuracy at high speed and for high fabrication volumes. Once a galvo-scanner is added, the processing speed in 2D rises to extreme values, whereas the rotary and tilt axes transform the workstation into a truly 3D tool.

Laser choice

• PL10100with CW diode pumped regenerative amplifier – a good balance between pulse repetition rate and pulse energy
• PL11Mwith cavity-dumped oscillator – MHz pulse repetition rate
• FOXTROTwith pulsed-diode-pumped amplifier – the highest pulse energy
• 1064, 532 and/or 355 nm wavelength, adjustable to material/process
• Integrated pulse and energy control providing flexible pulse-on-demand and burst mode operation, as well as fluence manipulation.

Optics

Advanced beam delivery scheme and cleverly designed focusing optics couple to precisely deliver the laser energy to the target spot intended. Wide range of laser fluences is available for the laser machining process.

Software

• Real-time operation in MS Windows environment
• Synchronized control of positioning and laser subsystems
• Possibility to integrate additional process-specific devices
• Compatibility with CAD and graphic file formats

Advanced software provides full automatic control of all system units. Intuitive and easy at use, it makes the system either flexibly adaptive or process specific. To speed the work up, two different kinds of parameters can be saved into separate files, namely: system parameters (such as speed of positioning

stages, laser pulse repetition rate etc.) apart from those related to processing „geometry“ (size, depth, arrangement etc.). Remote control and fast support via internet is foreseen.

Options

• Vacuum chuck and workpiece fixture
• Rotary and tilt/dwell axes for increased performance
• Vision control with CCD camera