4月24日，上海世博展览馆9号会议室

工业界正在尝试探索采用低温焊料组装手机、平板电脑和移动电脑等消费电子产品。将锡银铜（SAC）焊膏的峰值回流温度从当前240℃以上的水平降低，由此带来经济性、环境和技术上的优势。低温焊接还为新兴市场如超移动计算、可穿戴设备和物联网（IOT）提供了一种潜在的解决方案，以减少更小、更薄和高度集成的电子设备的组装中的动态翘曲。将回流峰值温度降低到200℃以下可以降低能耗，提高表面贴装良率，但同时也需要新的焊接材料具备良好的可靠性和工艺性。

iNEMI技术工作坊鼓励与会者在研讨中互动，讨论和分享有关低温焊料的信息和经验，例如：

· 低温焊料材料和技术的新发展和未来计划

·iNEMI基于锡铋的低温焊接工艺和可靠性项目报告

· 提高产量和质量所需的研究创新

· 未来产品和技术的要求对焊锡材料和工艺的影响

· 低温焊锡材料的工艺性、可靠性和失效分析

· 讨论新的合作项目机会，推动低温焊锡技术在行业中的开发和部署

本次专项研讨会的目标人群是致力于开发和鉴定新型低温焊料解决方案的电子制造商、研究人员和供应商，您将有机会和他们会面并分享和讨论。

议程计划

时间	议题	演讲嘉宾
9:30 – 9:45	签到
9:45 – 10:00	欢迎及研讨会简介	傅浩博士，iNEMI国际电子生产商联盟
10:00 – 10:30	使用低温焊接的表面贴装技术	Kok Kwan Tang，CPTD技术项目经理，Intel英特尔
10:30 – 10:55	电子封装中的低温焊接合金系统	沈骏教授，博导，重庆大学
10:55 – 11:20	iNEMI基于锡铋的低温焊接工艺和可靠性项目报告,傅浩博士,亚太区及项目管理总监, iNEMI国际电子生产商联盟
11:20 – 11:45	题目待定	戴尔
11:45 – 13:00	午餐
13:00 – 13:25	新一代SMT低温焊接材料的开发	Naoki Kubota，技术销售专员，田村电子
13:25 – 13:50	用于SMT的低温焊接”	Domini Zhang，运营工程经理，伟创力
13:50 – 14:15	先进的表面贴装无铅低温焊接材料	Watson Tseng，研发副总裁，美国总经理，昇贸科技
14:15 – 14:30	茶歇
14:30 – 14:55	用于下一代装配的高可靠低温焊接合金	Annie Yang，中国区市场经理，麦德美爱法
14:55 – 15:20	电子装配中的低温焊接技术—对装配和可靠性的挑战	尚攀举博士，资深工程师，华为
15:20 – 15:45	优诺LTS解决方案和应用实践— NWO的解决与LTS混合焊点评价新方法	陈钦，研发经理，苏州优诺
15:45 – 16:00	茶歇
16:00 – 16:20	座谈专家简报
16:20 – 17:00	座谈问答
17:00 – 17:15	总结

报名注册

早鸟票（3月31日前）：760元人民币，

常规票（3月31至4月18日前）：900元人民币

*登记费包括会议报告的材料、午餐券、咖啡/茶和水。

人民币（支付）：

账户名： 澳龙信息科技（上海）有限公司

账号：310066865018010020955

收款行： 交通银行上海市分行张江支行

开票事宜请联系：sammulw@infosalons.com.cn

iNEMI Low-Temperature Solder Workshop – SMTA China East Conference

Join iNEMI at NEPCON China in Shanghai to discussnew developments and future plans for low-temperature solder materials and techniques.

iNEMI Low-Temperature Soldering Workshop

Held at 2019 SMTA China East Conference

Shanghai World Expo Exhibition and Convention Center

Wednesday, April 24 / 9:00-16:45 / Meeting room #9

Industry is exploring the adoption of low-temperature solderfor the assembly of consumer electronic products, such as cell phones, tablets and mobile computers.Lowering peak reflow temperature from the current 240oC+ level for SnAgCu (SAC) solder paste has economic, environmental and technical benefits. Low-temperature soldering also provides a potential solution for reducing dynamic warpage in the assembly of smaller, thinner and highly integrated electronic packages for emerging markets such as ultra-mobile computing, wearable devices and Internet of Things (IoT). Lowering the reflow temperature below 200oC can reduce energy consumption and improve surface mount yields, but it also requires a new class of reliable soldering materials and processes.

This iNEMI workshop will provide an interactive forum where participants can discuss and share information about low-temperature solder such as:

·New developments and future plans for low-temperature solder materials and techniques

·Results from iNEMI’s BiSn-based Low-Temperature Soldering Process and Reliability project

·Innovations required to improve yield and quality

·Impact of future product and technology requirements on solder materials and processes

·Processability, reliability and failure mechanisms of low-temperature solder materials

·Collaborative project opportunities to streamline low-temperature solder technology development and deployment in the industry

This workshop gives you the opportunity to meet and network with leading electronics manufacturers, researchers and suppliers who are working to develop and qualify new low-temperature solder solutions.

Registration

Early bird registration is USD$100 (CNY760) until March 31, after which the fee is $120 (CNY 900). The registration fee covers workshop presentations, lunch coupon, coffee/tea breaks and water.

Click here for additional details, including agenda and registration.
https://community.inemi.org/ev_calendar_day.asp?date=4/24/2019&eventid=257

Preliminary Agenda

Time		Topic	Speaker
9:30 – 9:45		Sign for workshop attendance
9:45 – 10:00		Welcome and Workshop Overview	Dr. Haley Fu, Director for Asia Pacific & Project Management, iNEMI
10:00 –10:30		Surface Mount Technology Using Low Temperature Soldering	Kok Kwan Tang, CPTD Technical Program Manager, Intel
10:30 –10:55		Low Temperature Solder Alloy System in Electronic Packaging	Dr. Jun Shen, Professor, PhD Advisor, Chongqing University
10:55 –11:20		iNEMI BiSn-based Low-Temperature Soldering Process and Reliability Project Report	Dr. Haley Fu, Director for Asia Pacific & Project Management, iNEMI
11:20 –11:45		Presentation title & speaker TBC	Dell
11:45 –13:00		Lunch
13:00 –13:25		Development of Low Temperature Solderfor Next Generation SMT	Naoki Kubota, Technical Sales Specialist, Tamura
13:25 –13:50		Low Temperature Solder for SMT	Domini Zhang, Operations Engineering Manager, Flex
13:50 –14:15		Advanced Low Temp Lead-free Solder for SMT Assembly	Watson Tseng, Vice President of R&D and General Manager of America, Shenmao Technology
14:15 –14:30		Tea break
14:30 –14:55		High Reliability Low Temperature Soldering Alloys for Next Generation Assemblies	Annie Yang, Regional Marketing Manager – China, MacDermid Alpha
14:55 –15:20		Application of Low Temperature Soldering Technology in Electronic Assembly—Assembly and Reliability Challenges	Dr. Panju Shang, Senior Engineer, Huawei
15:20 –15:45		Solution and Application Practice of Eunow’s LTS paste — NWO Solution and new method of LTS Mixed Solder Joint evaluation	Qin Chen, R&D Manager, Eunow
15:45 –16:00		Tea break
16:00 –16:20		Presentation from panel list
16:20 –17:00		Panel discussion
17:00 –17:15		Wrap up